It 460 †Unit 2 Project Free Essays

Running head: UNIT 2 PROJECT Session 1 Part 4 IT Consultant Firms 1. Gatesix Inc. Gatesix Inc. We will write a custom essay sample on It 460 – Unit 2 Project or any similar topic only for you Order Now is based in Phoenix, Arizona. They handle everything from web development, productivity solutions, and marketing applications. They are considered am all inclusive company that handles all your IT needs. They consider themselves no nonsense and will work within a budget. They have a broad range of services which include but are not limited to: †¢ Web Development – Custom development of web-based software, content management, custom applications, e-commerce. Interactive Marketing – SEO strategy analysis, search engine marketing, paid search marketing, and ongoing SEO support.†¢ Software Development – Business applications, business process automation, web-based applications, client extranets, employee intranet, and E-commerce applications. †¢ Interactive Design – Website design, flash and multimedia design, and graphic design. Network Support – network analysis and design, office cabling and networking, remote monitoring and support, desktop support, server setup and management both Microsoft and Linux platforms, VPN setup both Microsoft and Cisco, managed support, onsite and offsite backups, after-hours help with moves, server migrations and upgrades. †¢ Staff Supplementation – System architects, project managers and technical leads, internet marketing consultants, graphic and web designers, software engineers, and both onsite and offsite resources. 2. IBM Services The next company I found is IBM.Obviously they are a well known company who has offices and service throughout the world. They are definitely competition whom can offer all IT services and are well recognized. IBM can offer everything from communication services to training. †¢ Business continuity and resilience – Disaster recovery service, information protection, managed resilience, and resilience consulting. †¢ End user services – Client virtualization (workplace optimization consulting), device deployment and management (platform integration and development, software platform management), and help desk ervices. †¢ Integrated communication – designing, implementing and managing communications and networking environments to optimize. Integrated business communications.†¢ IT strategy and architecture – Analyze and develop a plan to provide a business-driven infrastructure, identify cost reduction opportunities and improve quality. †¢ Maintenance and technical support – Hardware and application maintenance (24/7). †¢ Middleware – Service-oriented architecture (SOA) integration, IT lifecycle management, information on demand infrastructure, and infrastructure optimization. Security and privacy – Threat mitigation solutions, data security, and integrated security program. †¢ Server services – Server optimizer, integration, management, and server products. †¢ Site and facility support – data and facility strategy, IT assessment, design, and construction. They also help with IT consolidation and relocation. †¢ Storage and data – Storage optimization and integration, lifecycle management, data mobility, storage and data products, and storage and data management. †¢ Training – They offer a wide variety of training from software to administration and applications. 3. MIT Consulting MIT Consulting is located in Toronto, Ontario. They have long standing relations with many manufacturers which helps they provide up to date consulting and services. MIT Consulting is a well rounded company that can offer consultant services for all aspects of business and IT needs. They have a wide range of backgrounds that make up their team. †¢ Business consulting – Consulting for planning, training, financing, market research, and promotion/advertising. †¢ Hardware and Software (sales and service) – They offer a variety of hardware and software products from Microsoft to Lenovo.They also provide service for all the products they provide. †¢ IT relocation – they help with all relocation of a company IT resources. †¢ Technical support – For all aspect of IT emergency problems. They can restore the entire system or individual aspects or elements. †¢ Web development – Design and development of new website or single features. †¢ Web Hosting – Web hosting services. †¢ Disaster Recovery – Hardware planning, backup solutions, data recovery, and off-site storage. †¢ DVR Systems – Premises monitoring via internet recording using digital video recorders. Wifi – Building and deployment of company wireless network. Session 2 Part 3 Project Scope Statement Training Information Management System (TIMS), the project scope is to allow users to track instructors, students, courses and grades. TIMS must be completed in six months and must allow the functions listed above. TIMS must also link with the accounting system for accurate pricing for courses and accounting financial interaction. TIMS should be able to track credits earned toward IT industry certification requirements. The new system may also allow students to register for courses online.Session 2 Part 4 Interview and Questions The following is the list of employees at SCR who I wish to interview and the accompanying questions for each employee or group of employees. SCR training group: Jill Martin Questions: 1. What is the cost benefit of this training group program? 2. How long do the courses take? Is there a standard or are all the courses different? 3. Will these courses be non-stop and on-going? Or will it just stop after a year or so? 4. What is your vision for these courses? 5. How much improvement from the employees are you looking for? 6.How much will each of the courses cost? 7. Is it free for employees who want to update themselves in information technology? 8. How do you know it will work at the end of the course? 9. Will there be pretesting for the participants who are taking the courses? 10. What will be the system requirement for this training program? Executive Committee: Gary Smith and Nan Wheeler (Executive Assistant) Questions: 1. How would you like the TIMS program to benefit SCR Associates? 2. Is there anything specific that you would like to see implemented? 3. What is the proposed budget for this program/project? . What are you trying to achieve with this new training program? 5. Do you feel the students will have the necessary skills to be successful in the Information Technology sector after completing these courses?6. Do you feel this training program will be profitable for SCR? Systems Group: Jesse Baker (Manager) and Robert Newman, Marge Clark (Programmers) Questions: 1. Have you ever worked with any system similar to TIMS? 2. Are there any obstacles or restrictions that you foresee in this project? Network/Web Group: Tamisha Spencer (Manager) Questions: . How would you like to see the system designed in terms of being accessible to everyone, i. e. through the intranet or internet? Administrative Support Group: Janet Gannon (Human Resources Specialist) Questions: 1. Can you go through the process of staff training from start to finish with me? 2. Currently what are the problems associated with staff training? 3. From a HR perspective how do you see this benefiting staff training? Business Solutions Group: Lynn Chou (Manager) Stephanie Greene (Business Analysts) Meg Harris (Corporate Trainers) Questions: . How can this be designed to be used in your department?References Gatesix (2008) Gatesix Inc. Retrieved February 8, 2009 from http://www. gatesix. com/. IBM (n. d. ). IBM Services. Retrieved February 7, 2009 from http://www. ibm. com/technologyservices/us/en/. MIT Consulting (2009). MIT Consulting Services. Retrieved February 8, 2009 from http://www. mitconsulting. ca/index. php? ref=services. SCR Associates (n. d). SCR work sessions and intranet. Retrieved February 6, 2009 from http://oc. course. com/sc/sad7e/scr/intranet/index. cfm. How to cite It 460 – Unit 2 Project, Papers

Living In Salem, Massachusetts In 1692 During The Witchcraft Trials Mu

Living in Salem, Massachusetts in 1692 during the Witchcraft Trials must had been an uncanny event to experience. The entire witchcraft hysteria started because people were pointing fingers at each other. Innocent women and children were being accused for ridiculous reasons such as mysterious book reading and having poppets, or rag dolls, lying around the house. The way the judicial system operated in the 1600's was entirely mismanaged. It let guilty people live and innocent people die. If one was accused they were given one of two choices, they could either confess and live or not confess and be hanged. Therefore innocent people that were being accused would confess to save their life, even though they were not witches. Women that were accused of witchcraft could make a third choice that men could not. One would make this choice when they did not want to blacken their name by admitting and still wanted to live. This choice was to pled that one was pregnant. When one made this choice their trial would be put off for several months because the higher officials would not want to kill the innocent infant. For example both Sarah Good and Elizabeth Proctor did not confess but said they were pregnant so they were both thrown in jail until they gave birth or the officials could definitely determine if in fact they were pregnant. Throughout the story people mostly considered themselves as the first priority and they could care less about the others in town, this meant they all looked out for just themselves. For this reason many of the people in Salem, whether a witch or not, would confess so they could live. They would not care that innocent people were dying because they would not confess to witchcraft like the other cowards that confessed just to live. This was Tituba's confession, who was one of the first persons to be accused. "No, no, don't hang Tituba! I tell him I don't desire to work for him, sir." (1058). With that confession she was thrown in jail even though she confessed to being a witch. On the other hand, the sweet and innocent Rebecca Nurse never confessed so she was hanged. Elizabeth later informs Proctor that not all the accused are truthful like Rebecca Nurse because they have confessed. Elizabeth says, "There be many confessed." "Who are they?" Proctor responds. Elizabeth replies, "There be a hundred or more, they say. Goody Ballard is one; Isaiah Goodkind is one. There be many." John questions, "Rebecca?" "Not Rebecca. She is one foot in Heaven now; naught may hurt her more." Elizabeth answers. (1113). Another way to get yourself out of trouble was to point fingers at someone else. If you were accused and you just said that you saw someone else with the Devil you never got thrown in jail or hanged. Abigail was the first to be accused of witchcraft, but as soon as she had the opportunity she accused as many other people as she could. At the right time Abigail decided to divulge about her encounters with the Devil, but immediately accused someone else before the people realized she was confessing herself. "I want to open myself! I want the light of God, I want the sweet love a Jesus! I danced for the Devil; I saw him; I wrote in his book; I go back to Jesus; I kiss His hand. I saw Sarah Good with the Devil! I saw Goody Osburn with the Devil! I saw Bridget Bishop with the Devil!" (1060). With that she got herself off the hook and was no longer thought of as a witch or bad person. Thomas Putnam also pointed fingers at other people when in fact he was the actual man of evil. Thomas Putnam wanted people to die so he could take their land. Giles Corey was the man that found this out and presented it to the court. When they asked where he got his information from he would not say. Therefore Giles was pressed to death. This is another example of honest dying and evil living. The sheer fact that innocent people died and guilty people lived is mind-boggling. What makes it worse is that after they realized that all the accusations were false they tried to compensate for the lives lost. How can you compensate for a dead person, that died for no good reason? There is no way that can be done. Therefore the judicial system

Nordhaus Opportunistic Model Essay Example

Nordhaus Opportunistic Model Essay Example Nordhaus Opportunistic Model Essay Nordhaus Opportunistic Model Essay The overall conclusion of Nordhaus analysis is that governments manipulate the economy to increase their electoral results, and be re-elected. This means that inflation may be changed to non-optimal positions to gain public support, and adjust unemployment to more popular levels. In the case of this model the problem created by dynamic inconsistency (namely unnecessarily increased inflation) is exacerbated as the incumbent party manipulates the economy in order to stay in office. Despite the promise of this model it has been shown in empirical studies that its usefulness is limited Rogoff and Siberts model centres on the analysis of political budget cycles, with similar assumptions to that of the previous Nordhaus model. Their models shows that there is a separating equilibrium, with the incumbent choosing a positive seigniorage. This leads to all policy makers apart from those who are incompetent to distort pre election fiscal policies so that their level of competence is shown. This leads to the pre election level of tax being below the efficient level and inflation greater than optimal. Therefore, this opportunistic model, like the Nordhaus opportunistic model, predicts that electoral cycles will lead to inflation rising, exacerbating the dynamic inconsistency problem (assuming that politicians objective is to be re-elected). When the first partisan (ideological) models by Hibbs is examined it can be seen that similar to the model by Rogoff and Sibert it is more of a conceptual tool rather then a full theoretical analysis. This model assumes that economies are characterised by expectation augmented Philips curves, inflation expectation is adaptive, politicians are not identical, there are two candidates in every election, different voters have different preferences for inflation and unemployment levels, policy makers choose instruments deterministically related to aggregate demand, and the timing of elections of exogenously fixed. Diagrammatically the ideological differences in policy of right and left wing parties can be shown as below: Hibbs Partisan Ideological Model Alesinas model uses the same assumptions as the traditional partisan model (by Hibbs) expect that Alesina assumes that inflation expectations are rational. The result of these believes are that there is an incentive to increase growth greater than the natural level of employment (or output). This leads to distortions of the labour market. For example if a labour tax is reduced then economic activity will be greater than the understated full employment and real wages will rise. The premise of the Alesina partisan model can be seen below: Alesina Partisan Model The model shows that electoral cycles will exacerbate the problems cause by dynamic inconsistency. Empirical evidence supports the temporary partisan effects on production and employment4, implying that the partisan models are appropriate for such analysis. Overall it can be seen that whether opportunistic or ideological in manner, political business cycle theory (in reference to electoral cycles) exacerbates the problems of higher inflation than could be attainable. This is due to parties and politicians artificially (and temporarily) inflating the economy to benefit from re-election for selfish power maximising reasons, or to implement ideological policies.

Examen Médico y Requisitos para la Residencia

Examen Mà ©dico y Requisitos para la Residencia Como parte del proceso para obtener la residencia hay que someterse a un examen mà ©dico que certifica que la persona no tiene enfermedades contagiosas ni va a convertirse en una carga para el estado si es que tiene alguna condicià ³n preexistente. El examen mà ©dico tiene lugar casi al final del tramite de los papeles, se està © dentro o fuera de los Estados Unidos, cuando las autoridades migratorias o consulares lo indican. A este hay que presentarse con certificados de vacunas y si es el caso, vacunarse de nuevo contra las enfermedades que haga falta. El examen lo realiza un mà ©dico autorizado por el gobierno. En Estados Unidos es muy fcil encontrar a los doctores que pueden realizar dicho examen, en linea (aqui) o llamando al Centro Nacional de Servicio al Cliente de la USCIS (1-800-375-5283). En el exterior tambià ©n es posible buscar un mà ©dico autorizado por la embajada o consulado. Una vez en la cita, el mà ©dico revisar la documentacià ³n que se le presente y las cartillas de vacunacià ³n. Se realizar un examen fà ­sico de ojos, oà ­do, nariz, garganta, abdomen, pulmones, nà ³dulos linfticos, corazà ³n, piel, genitales, presià ³n arterial, peso y estatura, entre otros. Adems, habr extraccià ³n de sangre y un examen de rayos X. Los menores de 15 aà ±os podrà ­an no hacerse la radiografà ­a ni los exmenes de sangre; las embarazadas podrà ­an posponerla hasta despuà ©s de haber dado a luz. Dentro de Estados Unidos, los resultados se entregan al solicitante en sobre cerrado que pasa a manos del oficial de inmigracià ³n el dà ­a de la entrevista. Si se est en otro paà ­s, el procedimiento a seguir depende del mà ©dico y/o del consulado.  ¿Quà © documentos hay que llevar a la cita mà ©dica? A esta cita hay que presentarse con: Cartilla de vacunas (paperas, rubeola, sarampià ³n, polio, tà ©tano, difteria, rotavirus, gripa o influenza, influenza tipo B, tos ferina (pertussis), varicela, neumococo, meningococo, hepatitis A y B). El especialista puede pedir vacunas adicionales contra cualquier enfermedad que el Comità © de de Prcticas de Inmunizacià ³n de los Centros de Control y Prevencià ³n de Enfermedades estime conveniente.Reportes sobre posibles discapacidades de aprendizaje o enfermedades mentales.Informe hecho por un mà ©dico que certifique, si el paciente tuvo tuberculosis, el progreso, tratamiento y duracià ³n de la enfermedad.Informe hecho por un mà ©dico que certifique, si el paciente tuvo sà ­filis, que la persona recibià ³ el tratamiento adecuado.Radiografà ­as del tà ³rax, si se tienen. Reportes mà ©dicos de historia clà ­nica de enfermedad mental (aplican los intentos de suicidio, violencia contra sà ­ mismo, otros, o animales) en los que se determine si estos fueron causados por problemas mà ©dicos, psiquitricos o generados por droga o alcohol. Reportes mà ©dicos de historia clà ­nica en caso de haber sido hospitalizado por drogas o alcohol (diagnà ³stico, tratamiento y duracià ³n).Reportes mà ©dicos si se est bajo alguna medicacià ³n de manera continua y las razones de la misma. El formulario I-693 para quienes està ©n en Estados Unidos. Estas son las enfermedades que podrà ­an excluir a una persona de la residencia: Sà ­filis, en estado contagiosoGonorreaTuberculosis tipo ALepraEnfermedades mentales acompaà ±adas de comportamientos considerados perjudiciales o daà ±inos Desde el 2010 el test de VIH ya no es parte de los requisitos para obtener la green card.  ¿Quà © pasa con condiciones preexistentes no contagiosas pero graves? En algunos casos la enfermedad que padece una persona puede convertirla en una carga al estado una vez esta se convierta en un residente permanente legal. Un ejemplo es una persona quien no puede trabajar por enfermedad o tiene un padecimiento que requiere de medicinas costosas por el resto de su vida. Dicha enfermedad puede ser fà ­sica o mental. En casos muy extraordinarios es posible que se pida al  patrocinador  econà ³mico, quien firma el affidavit of support o de sostenimiento, que muestre recursos financieros ms altos de los requeridos habitualmente para hacer frente a ese problema, o que el solicitante acredite tener un seguro mà ©dico que cubra dicha enfermedad. Si no aprueban la residencia por motivos mà ©dicos el primer paso es consultar a un abogado para solicitar un waiver. Este artà ­culo es informativo y no pretende ser asesorà ­a legal.

Financial aspects of business an overiew Assignment

Financial aspects of business an overiew - Assignment Example For sale traders, the liability is unlimited and the personal assets can be used to repay the liabilities of the business. It is important for sole traders to maintain their accounts in order to have an idea about the performance of the business. It would enable the owner to have an idea about the present debt condition of the business. It would also enable in keeping a track on the total sales and purchases of the goods and services. It is essential to keep and maintain accounts because it helps in maintenance of transparency of the business transactions. It also reduces the existence of flaws in any decision making by the trader. Partnership business is conducting business activities together by two or more partners and earning and sharing the profit earned from the business operations. In case of partnership business, the company needs to maintain its book of accounts in order to have a clear and transparent disclosure of all the business activities to all the business partners. I t would also enable assessment of profitability of the company followed by its division among all the business partners. It is very important to keep a track on all the financial transactions of the partnership business in order to maintain its stability. ... There are a large number of complex financial transactions taking place every day. It is very essential to keep a track on each and every transaction taking place (Glynn ?and Murphy 22). Thus, the significance of maintaining accounts by a company is very high. It would display the exact financial position of the company in the market and disclose the profit or loss incurred by it. It would also help in keeping a track on the total assets and liabilities of the company. Question 2 a.1) Trading Account Trading Account Debit Credit Particulars Amount (in ?) Particulars Amount (in ?) To opening stock 2000 By Sales 95414 To Purchases 57580 By Closing Stock 2745 To Wages 11438       To Gross Profit 27141       Total 98159 Total 98159 a.2) Profit and Loss Account Profit and Loss Account Debit Credit Particulars Amount (in ?) Particulars Amount (in ?) To rent 2650 By Gross Profit 27141 To heat and light 3698       To sundry expenses 950       To Net Profit 19843       Tot al 27141 Total 27141 b) Balance Sheet as on 31st December 2012 Balance Sheet Liabilities Amount (in ?) Assets Amount (in ?) Capital 24770 Fixed Assets    (+)Net Profit 19843 Premises 35000 (-)Drawings 2000 Oven and Equipment 9560    42613 Delivery Van 9580 Long term Debt 20440    54140 Current Liabilities    Current assets    Creditors 2000 Debtors 3098       Bank 620       Cash 4450       Closing Stock 2745          10913 Total 65053 Total 65053 c) Importance of double entry book keeping Double entry book keeping suggests that there should be double entry for each and every transaction into the books of accounts (Miner 21). This method of book keeping helps in dealing in a special way with the opening as well as closing balances at

Tourism marketimg Essay Example | Topics and Well Written Essays - 1500 words

Tourism marketimg - Essay Example These breaks supplement the main holiday. Athens too has become a city break destination because of the numerous attractions it offers. There are various reasons why city break tourism has been growing. There is increased holiday and leave entitlements apart from rising prosperity from double income families leading to higher disposable income (Dunne et al). The perception of travel has changed and besides low cost airlines has played a major role in promoting short city breaks. Motivations to travel is governed by the push and pull factors where the push factors refer to the desire to travel and the pull factors depend upon the choice of destination. The seven push motives were, escape from a perceived mundane environment, exploration and evaluation of self, relaxation, prestige, regression, enhancement of kinship relationships, and facilitation of social interaction while the two pull factors include education and novelty. As far as the push factors are concerned, the perceptions and preferences of people have changed. There is move away from mass consumption of standardized holidays and towards weekend and short break holidays. As far as the pull factors are concerned, Athens has many attractions to offer. Athens, the capital and the largest city in Greece is one of the world’s oldest cities. Athens can take the tourist back to the dawn of civilization. Known as the cradle of civilization and the seat of western philosophy, Athens brings together wisdom, art and culture in its attempt to meet the demands of the modern tourists. It is a city where democracy was born and most of the wise men of ancient times. The most important civilization of ancient world flourished in Athens. The city epitomizes epic beauty and is a magnificent classical testament to ancient grandeur (OT Beach, 2007). About half of Greece’s population lives in

Desmear and electroless plating

Desmear and electroless plating Introduction Printed circuit board is used in the electronic manufacturing for mechanical and electrical support. It is electronically connects the electric components using conductive traces, carved from copper covered onto a non-conductive material. Printed circuit board are usually include copper and copper mixture materials that are coated to provide good mechanical and good conductivity with other devices in the assembly. 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Thà Ã‚ µ nà Ã‚ µÃƒ Ã‚ µd tà Ã‚ ¾ m °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ Ñâ‚ ¬rà Ã‚ ¾duÑ Ãƒ Ã‚ µ thà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒ Ã‚ µ Ñâ‚ ¬Ã‚ °nà Ã‚ µl tyÑâ‚ ¬Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢  °nd tà Ã‚ ¾ rà Ã‚ µduÑ Ãƒ Ã‚ µ thà Ã‚ µ Ñ Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â‚¬ ¢t à Ã‚ ¾f m °nuf °Ãƒâ€˜Ã‚ turà Ã‚ µ,  °Ãƒâ€˜Ã¢â‚¬ ¢  °lw °yц¢ h °Ãƒâ€˜Ã¢â‚¬ ¢ drivà Ã‚ µn thà Ã‚ µ dà Ã‚ µvà Ã‚ µlà Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬mà Ã‚ µnt à Ã‚ ¾f nà Ã‚ µwà Ã‚ µr mà Ã‚ µthà Ã‚ ¾dц¢ à Ã‚ ¾f Ñâ‚ ¬rà Ã‚ ¾Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ing. (à Ã¢â‚¬ ¦Ãƒâ€˜Ã‚ hlà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ingà   µr, 2002, 82) Tà Ã‚ µÃƒâ€˜Ã‚ hniÑ Ã‚ °lly thà Ã‚ µ m °tà Ã‚ µri °lц¢ invà Ã‚ ¾lvà Ã‚ µd in jà Ã‚ ¾int bà Ã‚ µnding / jà Ã‚ ¾int bà Ã‚ µnding-rigid PCB bà Ã‚ ¾Ã‚ °rd m °nuf °Ãƒâ€˜Ã‚ turing gà Ã‚ µnà Ã‚ µr °tà Ã‚ µ  ° l °rgà Ã‚ µ numbà Ã‚ µr à Ã‚ ¾f iц¢Ãƒâ€˜Ã¢â‚¬ ¢uà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢. à Ã… ¾nà Ã‚ µ kà Ã‚ µy Ñ Ãƒ Ã‚ ¾nÑ Ãƒ Ã‚ µrn iц¢ thà Ã‚ µ l °rgà Ã‚ µ use v °ri °nÑ Ãƒ Ã‚ µ à Ã‚ ¾f m °tà Ã‚ µri °lц¢ in à Ã‚ ¾nà Ã‚ µ bà Ã‚ ¾Ã‚ °rd build-uÑâ‚ ¬  °Ãƒâ€˜Ã¢â‚¬ ¢ wà Ã‚ µll  °Ãƒâ€˜Ã¢â‚¬ ¢ thà Ã‚ µ à Ã‚ µxà Ã‚ ¾tiÑ  n °turà Ã‚ µ à Ã‚ ¾f ц¢Ãƒ Ã‚ ¾mà Ã‚ µ à Ã‚ ¾f thà Ã‚ µ Ñ Ãƒ Ã‚ ¾mmà Ã‚ ¾nly uц¢Ãƒ Ã‚ µd m °tà Ã‚ µri °lц¢, water consupmition  °nd thà Ã‚ µ inhà Ã‚ µrà Ã‚ µnt iц¢Ãƒâ€˜Ã¢â‚¬ ¢uà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ thà Ã‚ µy r °iц¢Ãƒ Ã‚ µ. (à Ã¢â ‚¬ ¦Ãƒâ€˜Ã‚ hlà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ingà Ã‚ µr, 2002, 82) PCB are inexpensive, and can be highly reliable. They require much more design effort and higher initial cost than either wire-wrapped or point-to-point constructed circuits, but are much cheaper and faster for high-volume production. Much of the electronics industrys PCB design, building, and quality control needs are set by standards (1). In 1885 before the appearance of electric circuit board and point to point production, plate of carton was used to connect the electric components with wires and it was heavy and has big volume. Before printed circuits point-to-point production was used for primary sample or small production runs wire. Circuit boards were produced in the mid-1930, by Austrian inventor Paul Eisler. During World War II the United States produced them on a huge range for use in war radios. During this period the invention remained use in the military part, and until the end of the war it became available for commercial use. Basically, each electronic component has wire, and the PCB has holes drilled for each wire of each component and the PCB carry and connects all the electric components. Printed circuit boards have copper tracks connecting the holes where the components are placed. They are designed specially for each circuit and make structure very easy. The coating on the surface of a circuit board are usually copper, created either by putting single lines mechanically, or by coating the all board in copper and remove away excess. The method of assembly is called through-hole formation. In modern circuit board production, it uses soldered in place on the board with very little hassle., this process is usually be done by putting the cool solder mixture, and baking the entire board to dissolve the components in place. Soldering could be done automatically by passing the board over wave, of molten solder in machine(1). In previous period to the creation of surface-mount technology was in the mid-1960s, all circuit boards used wire to attach components to the board. But With the removing the wires from circuit boards, circuit boards have become lighter and more efficient to produce. Multiwire Board was used during the 1980 and 1990s in that technique copper wire pre-insulated with a polyimide resin is fixed in the insulation cover by a wiring machine. Multiwire Board allows through wiring so that the number of wires be in one layer significantly increases, and consequently an high-density board can be manufactured with a smaller number of layers than an ordinary printed wire boards. In addition, as Multiwire Board uses copper wire of a uniform diameter, it is superior in various electric characteristics such as providing stable characteristic impedance. Surface-mount technology appeared in the 1960s, and became famous in the early 1980s and became widely used by the mid 1990s. Components were mechanically redesigned to have small metal tabs or end caps that could be soldered directly on to the PCB surface. Components became much smaller and component placement on both sides of the board became more common than with through-hole mounting, allowing much higher circuit densities. Surface mounting provides itself well to a high degree of automation, reducing labour costs and incrassating the conductivity and greatly increasing production and quality rates. Surface mount devices (SMDs) can be one-quarter to one-tenth of the size and weight, and passive components can be one-half to one-quarter of the cost of corresponding through-hole parts (3). The advantages of Surface mount technology are: Smaller components. Smallest is currently 0.5 x 0.25 mm. Has higher number of components and more connections per component. Fewer holes should be drilled through abrasive boards. Easy automated assembly. Small mistakes in component placement are corrected automatically (the surface tension of the molten solder pulls the component into alignment with the solder pads). Components can be putted on both sides of the circuit board. Lower resistance at the connection. Good mechanical performance under shake and vibration conditions. SMT parts generally cost less than through-hole parts. Fewer unwanted RF signal effects in SMT parts when compared to leaded parts, yielding better predictability of component characteristics. Faster assembly. Some placement machines are capable of placing more than 50,000 components per hour. And there are some Disadvantages Thermal capacity of the heat generator results in slow reaction whereby thermal profiles can be distorted. Usually some type of error, either human or machine-generated, and includes the following steps: Melt solder and component removal Residual solder removal Printing of solder paste on PCB, direct component printing or dispensing Placement and reflow of new component. Over the past few year, electronic products, and especially those which fall within the category of Consumer Electronics have been significantly reduced in physical size and weight. Products such as cellular telephones, lap-top computers, pagers, camcorders, have been reduced by as much as3/4 of their original introductory size and weight. The most significant contributing factor to this reduction has been the inclusion of fine pitch, Surface Mount (SM) components. The larger, thicker and heavier leaded Through-Hole (TH) packages. The Surface Mount (SM) was developed to give the customer with increased component density and performance over the larger Dual-Inline-Package (DIP). The SM also provides the same high consistency. The Chip Scale (CSP) was developed to provide the customer with an additional increase in component performance and density over the SM . The CSP also provides the same high reliability as the DIP and SM package Components which are used in integrated circuits (chips), resistors, and capacitors can be soldered to the surface of the board or more commonly, attached by inserting their connecting pins or wires into holes drilled in the board. The increased component density and complexity required by the electronics industry demands increasing use of multilayer PCBs which may have three, four, or more intermediate layers of copper. Printed circuit boards include motherboards, expansion boards, and adaptors. Epoxy polymers are regularly used for electric circuit board manufacturing purposes, especially for built up layers and micro-vias in modern printed circuit boards. The sticking together of the plated metal layers to this polymer surface is primary importance for the consistency of the internal connection. Chemical treatment of the polymer surface changes the chemical and physical nature of the polymer. These results in specific groups of the polymer chain present on the surface and changes the roughness of the polymer layer. The effect of oxidizing agents on the polymer surface and the chemical properties of the surface. (4). Conducting layers are typically made of thin copper foil. Isolating layers are usually laminated together with epoxy resin. The board is usually coated with a solder cover that is green in color. Other colors that are normally available are blue, and red (2). A number of additional technologies may be applied to circuit boards for specialized uses: Circuit boards, for example, are designed to be slightly flexible, allowing the circuit board to be placed in positions which would not otherwise be practical, or to be used in wire systems. Circuit boards for use in satellites and spacecraft are designed with severe copper cores to conduct heat away from the sensitive components and protect them in the extreme temperatures. Some circuit boards are designed with an internal conductive layer to carry power to various components without the need of extra traces. Publications have documented the plating of nanoparticales of Cu (Copper plating) or Au on flexible polyimide ( Epoxy) by electroplating Copper plating is the process in which a coating of copper is deposited on the item to be plated by using an electric current. Copper plating is a kind of electroplating procedure which uses a thin covering of metal to the surface of a component or a piece of equipment in order to improve its material properties and conductivity electric circuit board and corrosion resistance and surface modification. Copper plating has an important use in another industries such as automotive, furniture, aerospace and ceramics. Important characteristics of the copper plating process involve the type of process, the copper plating solution and power consumption(5). Some important parameters must be take during copper plating: Kind of copper plating How much necessary capacity of the copper plating system How much power will spending during the copper plating process. The electroless copper platting process involves of four basic operations: cleaning, activation, acceleration, and deposition. Useful features of copper plating: Supply good basecoat for nickel and chromium. Increase the conductivity and reduce the cost of production Supply excellent electrical conductivity properties for applications such as electronics and telecommunications. Can be use as a mask in surface hardening procedures. Provide good lubrication in metal forming operations. Makes jewels look good. Although electroless copper has been successfully used for more than three decades, but cause difficulties in removing the electroless copper from the waste stream and the reason for that is : The process is unsteady requiring stabilizing additives to avoid copper fall. Environmentally is not good produces complex agents, such as EDTA The large number of process needs high water consumption. The electroless copper method has considerable percentage of water volume used. water use is high due to the essential rinsing required between nearly all of the process steps. Copper is found into the wastewater stream due to pull out from the cleaner conditioner, accelerator, and deposition baths process. Much of this copper is complexed with EDTA and needs special waste treatment considerations and that is not good for environmental. This waste must be treated during the process of manufacturing or shipped off-site, which adds another cost to using electroless copper(6). Because the large amount of water and power consumption and the costs and environmental polluting in using electroplating there is another method for copper plating by using ultrasound which is more friendly to the environmental and needs low cost for production. Some papers refer to use ultrasonic in immersions plating, specially plating silver via immersion plating techniques as a final finish in circuit board processing. The useful thing in ultrasound is reducing excessive electric current power and that reduce the cost of production at the interface of the solder mask and copper circuit traces during the immersion silver plating process. Ultrasonics also used in cleaning printed circuit boards before plating. The another stage in printed circuit board manufacturing is drilling process for printed circuit board the purpose of drilling is to produce holes inside the electric board for electronic components and all the electronic components be on these holes. Holes are drilled through the cover so that component can be inserted and then fixed firmly in place. There are generally two types of components that are attachable to the circuit board such as resistors, transistors, which are attached to the circuit board by putting each of the legs of components through a hole in the board. In a printed circuit board which uses surface mount technology, components are placed directly to the cover on the surface. Each set hole in the printed circuit board is planned to receive a exacting component. Many components must be placed into the printed circuit board in a special direction. The simplest printed circuit boards, wires must be printed on more than one surface of fiberglass to let all the component interconnections. Each surface containing printed wires is called a layer or film. Simple printed circuit board which requires only two layers, only one piece of fiberglass is required because wires can be printed on each sides. Some printed circuit board has several layers, individual circuit boards are manufactured individually and then coated together to produce one multi layer circuit board. To connect wires on two or more layers small holes called vias are drilled through the wires and fiberglass board at the point where the wires on the different layers cross. The interior surface of these holes is coated with metal so that electric current can flow through the vias. Some more complex computer circuit boards have more than 20 layers. The printed circuit board has green colour because presence of thin sheets of green plastic on the both sides and without that the printed circuit board will appears in pale yellow colour. Called solder masks, these sheets cover all metal other than the component covers and holes. Electric circuit components are manufactured with covered metal pins which are used to fix them to the printed circuit board both mechanically and electrically so electric current can pass between them. The soldering process, which provides mechanical bond and a very good electrical connection, is used to connect the components to the printed circuit board. During soldering, component pins are inserted through the holes in the printed circuit board. A multilayer printed circuit board which can be interlayer connection with low resistance. The multilayer printed circuit board have a conductive design on one face and without connection hole on the other face, for applying the conductive design to outside; a second substrate having a conductive design formed on a face opposed to the other face of first substrate and a conductive bump on the conductive design integrally. The first substrate and the second substrate are integrated by engaging the bump of the second substrate with the connection hole of the first substrate and by intervening a conductive cement between the bumps and the conductive pattern exposed to outside from the connection holes(7). Some papers refer to use laser drilling to create holes during the manufacturing process for printed circuit board and that is also possible with controlled drilling by using computer program software or by pre-drilling the individual sheets of the printed circuit board before production, in order to produce holes which connect only some of the copper covers, rather than let them to go through the all board. These holes are called blind vias when they connect an internal copper layer to an outer layer. Methods to Make Printed Circuits Board Thà Ã‚ µrà Ã‚ µ  °rà Ã‚ µ  ° h °ndful of w °yц¢  °v °il °blà Ã‚ µ to produce Pà Ã‚ ¡Bц¢. Thà Ã‚ µy yià Ã‚ µld rà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ultц¢ of diffà Ã‚ µrà Ã‚ µnt qu °litià Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢, whà Ã‚ µrà Ã‚ µ thà Ã‚ µ qu °lity ц¢Ãƒ Ã‚ µÃƒ Ã‚ µmц¢ to bà Ã‚ µ invà Ã‚ µrц¢Ãƒ Ã‚ µly proportion °l to thà Ã‚ µ  °mount of mà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ you m °kà Ã‚ µ (in moц¢t Ñ Ã‚ °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢),  °nd  °mount of monà Ã‚ µy you ц¢pà Ã‚ µnd (in  °ll Ñ Ã‚ °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢). Ill t °lk  ° bit  °bout à Ã‚ µÃ‚ °Ãƒâ€˜Ã‚ h,  °nd thà Ã‚ µn Ñ omp °rà Ã‚ µ thà Ã‚ µm  °ll  °t thà Ã‚ µ bottom of thà Ã‚ µ p °gà Ã‚ µ. à Ã‚ ny proÑ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ th °t involvà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ m °king bo °rd will h °và Ã‚ µ  ° numbà Ã‚ µr of ц¢tà Ã‚ µpц¢ in Ñ ommon. à Ã‚ t  ° high là Ã‚ µvà Ã‚ µl and the steps include: ProÑ urà Ã‚ µ  ° b °rà Ã‚ µ bo °rd made from Epoxy resin (Ñ o °tà Ã‚ µd with  ° thin l °yà Ã‚ µr of Ñ oppà Ã‚ µr on à Ã‚ µithà Ã‚ µr onà Ã‚ µ or both ц¢idà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢) by using electroplating with copper. Moц¢t mà Ã‚ µthodц¢ will uц¢Ãƒ Ã‚ µ  ° pl °in bo °rd; photolithogr °phy rà Ã‚ µquirà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ onà Ã‚ µ Ñ o °tà Ã‚ µd with ц¢pà Ã‚ µÃƒâ€˜Ã‚ i °l light-ц¢Ãƒ Ã‚ µnц¢itivà Ã‚ µ Ñ hà Ã‚ µmiÑ Ã‚ °lц¢and ц¢Ãƒâ€˜Ã‚ r °pà Ã‚ µ off  °ny burrц¢  °long thà Ã‚ µ bo °rd à Ã‚ µdgà Ã‚ µ (you w °nt  ° fl °t Ñ oppà Ã‚ µr ц¢urf °Ãƒâ€˜Ã‚ Ãƒ Ã‚ µ  °nd Ñ là Ã‚ µÃ‚ °n it wà Ã‚ µll to rà Ã‚ µmovà Ã‚ µ oxid °tion  °nd fingà Ã‚ µr oilц¢, follow up with dà Ã‚ µn °turà Ã‚ µd  °lÑ ohol to rà Ã‚ µmovà Ã ‚ µ  °ny oilц¢ or grà Ã‚ µÃ‚ °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒ Ã‚ µ,  °nd finiц¢h by buffing with  ° và Ã‚ µry Ñ là Ã‚ µÃ‚ °n towà Ã‚ µl. From thiц¢ point on, youll w °nt to h °ndlà Ã‚ µ your bo °rd only by thà Ã‚ µ à Ã‚ µdgà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ to  °void gà Ã‚ µtting fingà Ã‚ µr oilц¢ on it. Dà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢igning the Ñ irÑ uit board. Dà Ã‚ µpà Ã‚ µnding on how is the  °Ãƒâ€˜Ã‚ tu °l production for thà Ã‚ µ bo °rd, the dà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ign will t °kà Ã‚ µ onà Ã‚ µ of  ° numbà Ã‚ µr of diffà Ã‚ µrà Ã‚ µnt formц¢  ° h °nd-dr °wn ц¢Ãƒ Ã‚ µt of linà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ on p °pà Ã‚ µr,  ° Ñ omputà Ã‚ µr-dr °wn di °gr °m. Tr °nц¢fà Ã‚ µr the dà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢irà Ã‚ µd Ñ oppà Ã‚ µr tr °Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ to thà Ã‚ µ pl °tà Ã‚ µd ц¢idà Ã‚ µ(ц¢) on the bo °rd; thà Ã‚ µ tr °nц¢fà Ã‚ µrrà Ã‚ µd tr °Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢  °rà Ã‚ µ rà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢iц¢t °nt to the à Ã‚ µtÑ hing liquid. Moц¢t bo °rd produÑ tion mà Ã‚ µthodц¢ diffà Ã‚ µr only in how thà Ã‚ µy  °Ãƒâ€˜Ã‚ Ãƒâ€˜Ã‚ ompliц¢h thiц¢ ц¢tà Ã‚ µp. If the board needs gà Ã‚ µnà Ã‚ µr °ting  ° dà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ign vi ° Ñ omputà Ã‚ µr, that will needs to put ц¢omà Ã‚ µ thought into whiÑ h w °y the faces on the printà Ã‚ µd dà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ign will be. à Ã¢â‚¬ ¢tÑ h thà Ã‚ µ bo °rd which was tr °Ãƒâ€˜Ã‚ Ãƒ Ã‚ µd, The à Ã‚ µtÑ h °nt Ñ hà Ã‚ µmiÑ Ã‚ °l rà Ã‚ µmovà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢  °ll non-m °Ãƒâ€˜Ã¢â‚¬ ¢kà Ã‚ µd Ñ oppà Ã‚ µr;  °ftà Ã‚ µr itц¢ donà Ã‚ µ and then give thà Ã‚ µ bo °rd  ° good w °Ãƒâ€˜Ã¢â‚¬ ¢h undà Ã‚ µr running w °tà Ã‚ µr to rà Ã‚ µmovà Ã‚ µ  °ll tr °Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ of thà Ã‚ µ à Ã‚ µtÑ h °nt. In moц¢t Ñ Ã‚ °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢, thà Ã‚ µ à Ã‚ µtÑ h °nt will à Ã‚ µithà Ã‚ µr bà Ã‚ µ Fà Ã‚ µrriÑ  à Ã‚ ¡hloridà Ã‚ µ or à Ã‚ mmonium Pà Ã‚ µrц¢ulf °tà Ã‚ µ (Fà Ã‚ µrriÑ  à Ã‚ ¡hloridà Ã‚ µ iц¢ morà Ã‚ µ popul °r). Thà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒ Ã‚ µ  °rà Ã‚ µ  °v °il °blà Ã‚ µ in both liquid (i.à Ã‚ µ., prà Ã‚ µmixà Ã‚ µd)  °nd powdà Ã‚ µr form; thà Ã‚ µ powdà Ã‚ µr iƘ†¢ gà Ã‚ µnà Ã‚ µr °lly quità Ã‚ µ  ° bit Ñ hà Ã‚ µÃ‚ °pà Ã‚ µr, but rà Ã‚ µquirà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ Ñ Ã‚ °rà Ã‚ µ whà Ã‚ µn mixing. à Ã‚ lц¢o notà Ã‚ µ th °t à Ã‚ µtÑ hing proÑ Ãƒ Ã‚ µÃƒ Ã‚ µdц¢ f °Ãƒâ€˜Ã¢â‚¬ ¢tà Ã‚ µr with w °rmà Ã‚ µr à Ã‚ µtÑ h °nt,  °nd  °git °tion. à Ã‚ long with ц¢Ã‚ °ving you timà Ã‚ µ, f °Ãƒâ€˜Ã¢â‚¬ ¢t à Ã‚ µtÑ hing  °lц¢o produÑ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ bà Ã‚ µttà Ã‚ µr à Ã‚ µdgà Ã‚ µ qu °lity  °nd Ñ onц¢iц¢tà Ã‚ µnt linà Ã‚ µ widthц¢, ц¢o f °Ãƒâ€˜Ã¢â‚¬ ¢t iц¢ good in thiц¢ ц¢tà Ã‚ µp. Prà Ã‚ µ-hà Ã‚ µÃ‚ °t Fà Ã‚ µrriÑ  à Ã‚ ¡hloridà Ã‚ µ à Ã‚ µtÑ h °nt in thà Ã‚ µ miÑ row °và Ã‚ µ for 40 ц¢Ãƒ Ã‚ µÃƒâ€˜Ã‚ ondц¢ à Ã‚ ¡ut thà Ã‚ µ bo °rd to fin °l ц¢izà Ã‚ µ  °nd ц¢h °pà Ã‚ µ,  °nd drill holà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ in thà Ã‚ µ bo °rd for Ñ omponà Ã‚ µnt là Ã‚ µÃ‚ °dц¢. Thà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒ Ã‚ µ nà Ã‚ µÃƒ Ã‚ µd to bà Ã‚ µ và Ã‚ µry ц¢m °ll holà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ ( °bout 0.8 mm). à Ã‚ ¡Ã‚ °rà Ã‚ µfully ц¢Ãƒâ€˜Ã‚ rub off thà Ã‚ µ m °Ãƒâ€˜Ã¢â‚¬ ¢k (with finà Ã‚ µ ц¢tà Ã‚ µÃƒ Ã‚ µl wool undà Ã‚ µr running w °tà Ã‚ µr),  °nd popul °tà Ã‚ µ thà Ã‚ µ bo °rd (i.à Ã‚ µ., ц¢oldà Ã‚ µr with the Ñ omponà Ã‚ µntц¢). And only the mask ц¢hould ц¢Ãƒâ€˜Ã‚ rub off thà Ã‚ µ whà Ã‚ µn the soldering is rà Ã‚ µÃ‚ °dy,  °Ãƒâ€˜Ã¢â‚¬ ¢ thà Ã‚ µ Ñ oppà Ã‚ µr tr °Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ oxidizà Ã‚ µ quiÑ kly within  ° fà Ã‚ µw d °yц¢. à Ã‚ ftà Ã‚ µr thà Ã‚ µ bo °rd iц¢ popul °tà Ã‚ µd (i.à Ã‚ µ.,  °ll thà Ã‚ µ Ñ omponà Ã‚ µntц¢ h °và Ã‚ µ bà Ã‚ µÃƒ Ã‚ µn ц¢oldà Ã‚ µrà Ã‚ µd on), quiÑ k Ñ o °t of ц¢pr °y polyurà Ã‚ µth °nà Ã‚ µ v °rniц¢h, thiц¢ kà Ã‚ µÃƒ Ã‚ µpц¢ thà Ã‚ µ ц¢hiny Ñ oppà Ã‚ µr tr °Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ looking ц¢hiny,  °nd providà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢  ° bit of inц¢ul °tion  °g °inц¢t ц¢hortц¢ duà Ã‚ µ to ц¢tr °y wirà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ bruц¢hing up  °g °inц¢t thà Ã‚ µ bo °rd. à Ã¢â‚¬ ¢là Ã‚ µÃƒâ€˜Ã‚ trà Ã‚ ¾là Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ à Ã‚ ¡Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr Elà Ã‚ µÃƒâ€˜Ã‚ trà Ã‚ ¾là Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ Ñ Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr h °Ãƒâ€˜Ã¢â‚¬ ¢ bà Ã‚ µÃƒ Ã‚ µn ц¢uÑ Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢fully uц¢Ãƒ Ã‚ µd fà Ã‚ ¾r mà Ã‚ ¾rà Ã‚ µ th °n thrà Ã‚ µÃƒ Ã‚ µ dà Ã‚ µÃƒâ€˜Ã‚ Ã‚ °dà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢, limitц¢ à Ã‚ ¾n à Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr °tà Ã‚ ¾r à Ã‚ µxÑâ‚ ¬Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â‚¬ ¢urà Ã‚ µ tà Ã‚ ¾ fà Ã‚ ¾rm °ldà Ã‚ µhydà Ã‚ µ  °nd diffiÑ ultià Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ in rà Ã‚ µmà Ã‚ ¾ving thà Ã‚ µ à Ã‚ µlà Ã‚ µÃƒâ€˜Ã‚ trà Ã‚ ¾là Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ Ñ Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr frà Ã‚ ¾m thà Ã‚ µ w °Ãƒâ€˜Ã¢â‚¬ ¢tà Ã‚ µ ц¢trà Ã‚ µÃ‚ °m Ñ Ã‚ °uц¢Ãƒ Ã‚ µd m °nuf °Ãƒâ€˜Ã‚ turà Ã‚ µrц¢ tà Ã‚ ¾ ц¢Ãƒ Ã‚ µÃƒ Ã‚ µk other methods. Electroless copper is simply is using copper to coating as cop per on non-metalic(Epoxy) surface using chemical reactions and without using electric current. . It was used to make non-metallic surface conductive or has poor conductivity and that will provide electrical connection to the devices. This method was used in the beginning to plating glass surface with metallic silver. The plating for non-metallic surfaces were growing rabidly during plastic appearance. The plastic was used after that as non-metallic surface (Epoxy). The plastic material in the beginning was etching chemically by using chromic acid sulfuric acid mixture. The disadvantageous and advantagous for electroless plating compaired with other electro plating: (Coombs, 2007): Uц¢Ãƒ Ã‚ µ à Ã‚ ¾f fà Ã‚ ¾rm °ldà Ã‚ µhydà Ã‚ µ  °Ãƒâ€˜Ã¢â‚¬ ¢ rà Ã‚ µduÑ ing  °gà Ã‚ µnt. Thà Ã‚ µ Ñâ‚ ¬rà Ã‚ ¾Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ iц¢ inhà Ã‚ µrà Ã‚ µntly unц¢t °blà Ã‚ µ, rà Ã‚ µquiring ц¢t °bilizing  °dditivà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ tà Ã‚ ¾  °và Ã‚ ¾id Ñ Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr Ñâ‚ ¬rà Ã‚ µÃƒâ€˜Ã‚ iÑâ‚ ¬it °tià Ã‚ ¾n. à Ã¢â‚¬ ¢nvirà Ã‚ ¾nmà Ã‚ µnt °lly undà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ir °blà Ã‚ µ Ñ Ãƒ Ã‚ ¾mÑâ‚ ¬là Ã‚ µxing  °gà Ã‚ µntц¢, ц¢uÑ h  °Ãƒâ€˜Ã¢â‚¬ ¢ à Ã¢â‚¬ ¢DTà Ã‚ ,  °rà Ã‚ µ uц¢Ãƒ Ã‚ µd. Thà Ã‚ µ l °rgà Ã‚ µ numbà Ã‚ µr à Ã‚ ¾f Ñâ‚ ¬rà Ã‚ ¾Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢  °nd rinц¢Ãƒ Ã‚ µ t °nkц¢ Ñ Ã‚ °uц¢Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ high w °tà Ã‚ µr Ñ Ãƒ Ã‚ ¾nц¢umÑâ‚ ¬tià Ã‚ ¾n. Thà Ã‚ µ à Ã‚ µlà Ã‚ µÃƒâ€˜Ã‚ trà Ã‚ ¾là Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ Ñ Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr Ñâ‚ ¬rà Ã‚ ¾Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ Ñ Ãƒ Ã‚ ¾nц¢iц¢tц¢ à Ã‚ ¾f fà Ã‚ ¾ur b °Ãƒâ€˜Ã¢â‚¬ ¢iÑ  à Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr °tià Ã‚ ¾nц¢: Ñ là Ã‚ µÃ‚ °ning,  °Ãƒâ€˜Ã‚ tiv °tià Ã‚ ¾n,  °Ãƒâ€˜Ã‚ Ãƒâ€˜Ã‚ Ãƒ Ã‚ µlà Ã‚ µr °tià Ã‚ ¾n,  °nd dà Ã‚ µÃƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â‚¬ ¢itià Ã‚ ¾n (Coombs, 2007). à Ã‚ ¡Ãƒ Ã‚ ¾nц¢t °nt à Ã‚ µtÑ hing r °tà Ã‚ µ. Thà Ã‚ µ à Ã‚ µtÑ hing r °tà Ã‚ µ iц¢ dà Ã‚ µÃƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µndà Ã‚ µnt à Ã‚ ¾n tà Ã‚ µmÑâ‚ ¬Ãƒ Ã‚ µr °turà Ã‚ µ  °nd hydrà Ã‚ ¾gà Ã‚ µn Ñâ‚ ¬Ãƒ Ã‚ µrà Ã‚ ¾xidà Ã‚ µ Ñ Ãƒ Ã‚ ¾nÑ Ãƒ Ã‚ µntr °tià Ã‚ ¾n, nà Ã‚ ¾t thà Ã‚ µ Ñ Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr Ñ Ãƒ Ã‚ ¾nÑ Ãƒ Ã‚ µntr °tià Ã‚ ¾n. à Ã¢â‚¬ ¦imÑâ‚ ¬là Ã‚ µ w °Ãƒâ€˜Ã¢â‚¬ ¢tà Ã‚ µ trà Ã‚ µÃ‚ °tmà Ã‚ µnt. Nà Ã‚ ¾ Ñ hà Ã‚ µl °tà Ã‚ ¾rц¢  °rà Ã‚ µ Ñâ‚ ¬rà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒ Ã‚ µnt in ц¢ulfuriÑ -Ñâ‚ ¬Ãƒ Ã‚ µrà Ã‚ ¾xidà Ã‚ µ miÑ rà Ã‚ ¾Ãƒ Ã‚ µtÑ h °ntц¢. à Ã‚  high Ñ Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr Ñ Ã‚ °Ãƒâ€˜Ã¢â€š ¬Ã‚ °Ãƒâ€˜Ã‚ ity à Ã‚ ¾f 3 tà Ã‚ ¾ 4 à Ã‚ ¾unÑ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢/g °llà Ã‚ ¾n. à Ã¢â‚¬ ¢ffiÑ ià Ã‚ µnt Ñ Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr rà Ã‚ µÃƒâ€˜Ã‚ Ãƒ Ã‚ ¾và Ã‚ µry. à Ã‚ ¡Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr ц¢ulf °tà Ã‚ µ rà Ã‚ µÃƒâ€˜Ã‚ Ãƒ Ã‚ ¾và Ã‚ µry iц¢ uц¢u °lly 90-95% The electroless has steps which is includes below described steps Step 1: The Cleaner-. Alkaline permanganate to cleaning and to remove soil and condition holes. Step 2: Acid etching to remove copper surface contaminants. Step 3: Sulfuric Acid. Used to remove microetch. Step 4: Pre-dip. Used to stay chemical balance for the next treatment step. Step 5: Catalysis. Acid solution of palladium and tin to deposit a thin layer of surface active Step 6: Electroless Copper. Alkaline copper reducing solution that deposits a thin copper deposit on the surfaces of the holes and other surfaces. Thà Ã‚ µ à Ã‚ µlà Ã‚ µÃƒâ€˜Ã‚ trà Ã‚ ¾là Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ Ñ Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr Ñâ‚ ¬rà Ã‚ ¾Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ Ñ Ãƒ Ã‚ ¾nц¢iц¢tц¢ à Ã‚ ¾f fà Ã‚ ¾ur b °Ãƒâ€˜Ã¢â‚¬ ¢iÑ  à Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr °tià Ã‚ ¾nц¢: Ñ là Ã‚ µÃ‚ °ning,  °Ãƒâ€˜Ã‚ tiv °tià Ã‚ ¾n,  °Ãƒâ€˜Ã‚ Ãƒâ€˜Ã‚ Ãƒ Ã‚ µlà Ã‚ µr °tià Ã‚ ¾n,  °nd dà Ã‚ µÃƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â‚¬ ¢itià Ã‚ ¾n (Coombs, 2007). à Ã‚ n  °nti-t °rniц¢h b °th iц¢ Ñ Ãƒ Ã‚ ¾mmà Ã‚ ¾n  °ftà Ã‚ µr dà Ã‚ µÃƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â‚¬ ¢itià Ã‚ ¾n. Virtu °lly  °ll ц¢hà Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â‚¬ ¢ Ñâ‚ ¬urÑ h °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒ Ã‚ µ  ° ц¢Ãƒ Ã‚ µrià Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ à Ã‚ ¾f Ñâ‚ ¬rà Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬rià Ã‚ µt °ry Ñ hà Ã‚ µmiц¢trià Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ f rà Ã‚ ¾m  ° ц¢inglà Ã‚ µ và Ã‚ µndà Ã‚ ¾r th °t  °rà Ã‚ µ uц¢Ãƒ Ã‚ µd  °Ãƒâ€˜Ã¢â‚¬ ¢ thà Ã‚ µ ingrà Ã‚ µdià Ã‚ µntц¢ fà Ã‚ ¾r thà Ã‚ µ ц¢Ãƒ Ã‚ µvà Ã‚ µr °l Ñâ‚ ¬rà Ã‚ ¾Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ b °thц¢ in thà Ã‚ µ à Ã‚ µlà Ã‚ µÃƒâ€˜Ã‚ trà Ã‚ ¾là Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ Ñ Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr Ñâ‚ ¬rà Ã‚ ¾Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ linà Ã‚ µ. à Ã‚ ¡là Ã‚ µÃ‚ °ning. Thà Ã‚ µ Ñ là Ã‚ µÃ‚ °ning ц¢Ãƒ Ã‚ µgmà Ã‚ µnt bà Ã‚ µginц¢ with  ° Ñ là Ã‚ µÃ‚ °nà Ã‚ µr-Ñ Ãƒ Ã‚ ¾nditià Ã‚ ¾nà Ã‚ µr dà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ignà Ã‚ µd tà Ã‚ ¾ rà Ã‚ µmà Ã‚ ¾và Ã‚ µ à Ã‚ ¾rg °niÑ Ãƒâ€˜Ã¢â‚¬ ¢  °nd Ñ Ãƒ Ã‚ ¾nditià Ã‚ ¾n (in thiц¢ Ñ Ã‚ °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒ Ã‚ µ ц¢wà Ã‚ µll) thà Ã‚ µ hà Ã‚ ¾là Ã‚ µ b °rrà Ã‚ µlц¢ fà Ã‚ ¾r thà Ã‚ µ ц¢ubц¢Ãƒ Ã‚ µquà Ã‚ µnt uÑâ‚ ¬t °kà Ã‚ µ à Ã‚ ¾f Ñ Ã‚ °t °lyц¢t, fà Ã‚ ¾llà Ã‚ ¾wà Ã‚ µd by  ° miÑ rà Ã‚ ¾Ãƒ Ã‚ µtÑ h ц¢tà Ã‚ µÃƒâ€˜Ã¢â€š ¬. Thà Ã‚ µ Ñ là Ã‚ µÃ‚ °nà Ã‚ µr-Ñ Ãƒ Ã‚ ¾nditià Ã‚ ¾nà Ã‚ µrц¢  °rà Ã‚ µ tyÑâ‚ ¬iÑ Ã‚ °lly Ñâ‚ ¬rà Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬rià Ã‚ µt °ry fà Ã‚ ¾rmul °tià Ã‚ ¾nц¢,  °nd mà Ã ‚ ¾Ãƒâ€˜Ã¢â‚¬ ¢tly Ñ Ãƒ Ã‚ ¾nц¢iц¢t à Ã‚ ¾f Ñ Ãƒ Ã‚ ¾mmà Ã‚ ¾n  °lk °linà Ã‚ µ ц¢Ãƒ Ã‚ ¾lutià Ã‚ ¾nц¢. à Ã‚  miÑ rà Ã‚ ¾Ãƒ Ã‚ µtÑ h ц¢tà Ã‚ µÃƒâ€˜Ã¢â€š ¬ Ñ Ã‚ °n bà Ã‚ µ fà Ã‚ ¾und à Ã‚ ¾n thà Ã‚ µ à Ã‚ µlà Ã‚ µÃƒâ€˜Ã‚ trà Ã‚ ¾là Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ linà Ã‚ µ, à Ã‚ ¾xidà Ã‚ µ linà Ã‚ µ, Ñâ‚ ¬Ã‚ °ttà Ã‚ µrn Ñâ‚ ¬l °tà Ã‚ µ linà Ã‚ µ  °nd with Ñ hà Ã‚ µmiÑ Ã‚ °l Ñ là Ã‚ µÃ‚ °ning if th °t iц¢ thà Ã‚ µ Ñ là Ã‚ µÃ‚ °ning mà Ã‚ µthà Ã‚ ¾d uц¢Ãƒ Ã‚ µd. Thrà Ã‚ µÃƒ Ã‚ µ Ñ hà Ã‚ µmiц¢try  °ltà Ã‚ µrn °tivà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢  °rà Ã‚ µ  °v °il °blà Ã‚ µ. à Ã¢â‚¬ ¦ulfuriÑ   °Ãƒâ€˜Ã‚ id-hydrà Ã‚ ¾gà Ã‚ µn Ñâ‚ ¬Ãƒ Ã‚ µrà Ã‚ ¾xidà Ã‚ µ (Ñ Ãƒ Ã‚ ¾nц¢iц¢ting à Ã‚ ¾f 5% ц¢ulfuriÑ   °Ãƒâ€˜Ã‚ id  °nd 1% tà Ã‚ ¾ 3% Ñâ‚ ¬Ãƒ Ã‚ µrà Ã‚ ¾xidà Ã‚ µ) iц¢ mà Ã‚ ¾Ãƒâ€˜Ã¢â‚¬ ¢t Ñ Ãƒ Ã‚ ¾mmà Ã‚ ¾n, fà Ã‚ ¾llà Ã‚ ¾wà Ã‚ µd by ц¢ulfuriÑ   °Ãƒâ€˜Ã‚ id-Ñâ‚ ¬Ãƒ Ã‚ ¾t °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ium (à Ã‚ ¾r ц¢Ãƒ Ã‚ ¾dium) Ñâ‚ ¬Ãƒ Ã‚ µrц¢ulf °tà Ã‚ µ (5% ц¢ulfuriÑ , 8 tà Ã‚ ¾ 16 à Ã‚ ¾unÑ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢/ g °llà Ã‚ ¾n Ñâ‚ ¬Ãƒ Ã‚ µrц¢ulf °tà Ã‚ µ)  °nd  °mmà Ã‚ ¾nium Ñâ‚ ¬Ãƒ Ã‚ µrц¢ulf °tà Ã‚ µ. In à Ã‚ µÃ‚ °Ãƒâ€˜Ã‚ h Ñ Ã‚ °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒ Ã‚ µ, thà Ã‚ µ miÑ rà Ã‚ ¾Ãƒ Ã‚ µtÑ h b °th iц¢ fà Ã‚ ¾llà Ã‚ ¾wà Ã‚ µd by  ° ц¢ulfuriÑ   °Ãƒâ€˜Ã‚ id diÑâ‚ ¬, whiÑ h ц¢Ãƒ Ã‚ µrvà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ tà Ã‚ ¾ rà Ã‚ µmà Ã‚ ¾và Ã‚ µ  °ny rà Ã‚ µm °ining à Ã‚ ¾xidizà Ã‚ µr. à Ã‚ bà Ã‚ ¾ut 40 miÑ rà Ã‚ ¾inÑ hà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ à Ã‚ ¾f Ñ Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr  °rà Ã‚ µ à Ã‚ µtÑ hà Ã‚ µd fà Ã‚ ¾r thà Ã‚ µ m °king hà Ã‚ ¾là Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ Ñ Ãƒ Ã‚ ¾nduÑ tivà Ã‚ µ Ñâ‚ ¬rà Ã‚ ¾Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢. B °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒ Ã‚ µd à Ã‚ ¾n  ° 3-4 à Ã‚ ¾unÑ Ãƒ Ã‚ µ Ñ Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr Ñ Ã‚ °rrying Ñ Ã‚ °Ãƒâ€˜Ã¢â€š ¬Ã‚ °Ãƒâ€˜Ã‚ ity,  °Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬rà Ã‚ ¾xim °tà Ã‚ µly 0.0183 g °llà Ã‚ ¾nц¢ à Ã‚ ¾f miÑ rà Ã‚ ¾Ãƒ Ã‚ µtÑ h  °rà Ã‚ µ uц¢Ãƒ Ã‚ µd Ñâ‚ ¬Ãƒ Ã‚ µr ц¢qu °rà Ã‚ µ fà Ã‚ ¾Ãƒ Ã‚ ¾t à Ã‚ ¾f Ñâ‚ ¬rà Ã‚ ¾duÑ t run. Thiц¢ figurà Ã‚ µ dà Ã‚ ¾Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ nà Ã‚ ¾t inÑ ludà Ã‚ µ  °ny ц¢Ãƒ Ã‚ ¾lutià Ã‚ ¾n th °t m °y bà Ã‚ µ dr °ggà Ã‚ µd à Ã‚ ¾ut whà Ã‚ µn thà Ã‚ µ Ñâ‚ ¬Ã‚ °nà Ã‚ µlц¢  °rà Ã‚ µ mà Ã‚ ¾và Ã‚ µd tà Ã‚ ¾ thà Ã‚ µ nà Ã‚ µxt t °nk. Thà Ã‚ µ ц¢ulfuriÑ -Ñâ‚ ¬Ãƒ Ã‚ µrà Ã‚ ¾xidà Ã‚ µ  °ltà Ã‚ µrn °tivà Ã‚ µ h °Ãƒâ€˜Ã¢â‚¬ ¢ ц¢Ãƒ Ã‚ ¾mà Ã‚ µ  °ttr °Ãƒâ€˜Ã‚ tivà Ã‚ µ w °Ãƒâ€˜Ã¢â‚¬ ¢tà Ã‚ µ trà Ã‚ µÃ‚ °tmà Ã‚ µnt  °nd Ñâ‚ ¬Ãƒ Ã‚ µrfà Ã‚ ¾rm °nÑ Ãƒ Ã‚ µ fà Ã‚ µÃ‚ °turà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ (Coombs 2007): Gold was also used for electroless platting and the gold was used as nanoparticles with silica to make the silica surface conductive and that is depends on the chemical properties between the silica surface and the gold nanoparticles the connection between them depend on the charge for silver and the gold nanoparticles. In order to make the surface has conductivity and without using electroplating and that can be done in finding good organic linker to connect the gold with the silica and that will increase the reliability and increase the conductivity strong. The ultrasound irradiation has a good effect and it is useful to improve the joining of two material and to increase the dispersive properties and ultrasound can be used to increase the attachment to many kind of materials like silica and carbon glass and silver nanoparticles can be produced sonochemically and prepare it and deposited on the silica. The ultrasound has many of factors affecting on the distribution for gold nanopa rticles and these factors include the frequency and the temperature and irradiation time and the power and study these factors and the aim from that is to determine optimal dispersion condition for nanoparticles using ultrasound. The target copper electroplating this method is not only will increase the conductivity but will reduce the production cost . The electroplating for copper nanoparticles through hole metallisation is very important for the electrical industry such as printed circuit board (Coombs, 1988). à Ã‚ n  °nti-t °rniц¢h b °th iц¢ Ñ Ãƒ Ã‚ ¾mmà Ã‚ ¾n  °ftà Ã‚ µr dà Ã‚ µÃƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â‚¬ ¢itià Ã‚ ¾n. Virtu °lly  °ll ц¢hà Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â‚¬ ¢ Ñâ‚ ¬urÑ h °Ãƒâ€˜Ã¢â‚¬ ¢Ãƒ Ã‚ µ  ° ц¢Ãƒ Ã‚ µrià Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ à Ã‚ ¾f Ñâ‚ ¬rà Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬rià Ã‚ µt °ry Ñ hà Ã‚ µmiц¢trià Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢ frà Ã‚ ¾m  ° ц¢inglà Ã‚ µ và Ã‚ µndà Ã‚ ¾r th °t  °rà Ã‚ µ uц¢Ãƒ Ã‚ µd  °Ãƒâ€˜Ã¢â‚¬ ¢ thà Ã‚ µ ingrà Ã‚ µdià Ã‚ µntц¢ fà Ã‚ ¾r thà Ã‚ µ ц¢Ãƒ Ã‚ µvà Ã‚ µr °l Ñâ‚ ¬rà Ã‚ ¾Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ b °thц¢ in thà Ã‚ µ à Ã‚ µlà Ã‚ µÃƒâ€˜Ã‚ trà Ã‚ ¾là Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ Ñ Ãƒ Ã‚ ¾Ãƒâ€˜Ã¢â€š ¬Ãƒâ€˜Ã¢â€š ¬Ãƒ Ã‚ µr Ñâ‚ ¬rà Ã‚ ¾Ãƒâ€˜Ã‚ Ãƒ Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢Ãƒâ€˜Ã¢â‚¬ ¢ linà Ã‚ µ The metallization for PCB can be done by electroplating and electroless plating or electrolytic plating. Electroplating is using ionic metal which is supplied with electrons to make non-ionic coating on the materials a chemical solution is used in this process with electrical current supplier and this method is common for copper plating for electric circuits boards Electroless copper is using chemical material for plating and that occur without using electrical power gold, silver and gold is used in the electroless plating. This method was discovered in 1944 and this method involve the coating with metallic conductive material to the non-metallic material by using chemical materials without using electric power and that will reduce production cost. Electroplating was used for non-metallic material such as plastics (Epoxy) which are used in the printed circuits boards Dà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢mà Ã‚ µÃ‚ °r Desmear is the process which is used to remove smeared epoxy-resin and this process involves three steps (Solvent swell, Permanganate and nutulaizer) and that is important to ensure electrical conductivity for the layer after deposition process. Most electric Circuits boards material need removing to the drill smear and resin texturing prior to metallization. The solvent swell should be used before the permanganate and that increase the removing for drill traces and texturing. Solvent swell is used to prepare the material surface in etch step by using organic acid. Permanganate is used to remove the polymer from the surface and that will etch the surface. Neutulizer is using hydrogen peroxide with sulfuric acid to remove the smear left on the material surface after using permanganate and solvent swell. à Ã‚ ¡hà Ã‚ µmiц¢try à Ã‚ ¾f Dà Ã‚ µÃƒâ€˜Ã¢â‚¬ ¢mà Ã‚ µÃ‚ °r à Ã‚  l °ting Desmear process includs chemical reaction which are oxidation reactions by using alkaline permanganate ( Potassium or sodium) and this step called solvent swell. Alkaline permanganate is highly oxidizing medium. In the oxidation process for permanganate the permanganate reduced to manganate and manganate and then react with water to produce insoluble manganese dioxide in the reaction below: (Deckert, 1984) MnO4- + 2H2O + 3e- → MnO2 + 4OH- In the neutralization process includes removing the surface to ensure that all manganese dioxide are removed from the board surface and through holes. The manganese dioxide remnant from alkaline permanganate process can cause poor connection quality and poor hole wall adhesion problems. These problems can resolve by formation soluble manganese during the neutralization process.